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Surface Mounting Guide
Chip Thermistor – Application Notes
STORAGE
Good solderability is maintained for at least twelve months,
Wave
300
provided the components are stored in their “as received”
packaging at less than 40°C and 70% RH.
SOLDERABILITY / LEACHING
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds.
250
200
150
100
Preheat
T
230oC
to
250oC
Natural
Cooling
Terminations will resist leaching for at least the immersion
times and conditions recommendations shown below.
50
P/N
Termination
Solder
Solder
Immersion
0
Type
Tin/Lead
Temp oC
Time Seconds
1 to 2 min
3 sec. max
NC
NB
AgPdPt
Nickel Barrier
60/40
60/40
260 ± 5
260 ± 5
15 max
30 ± 1
(Preheat chips before soldering)
T/maximum 150°C
NB products are compatible with a wide range of soldering
conditions consistent with good manufacturing practice for
surface mount components. This includes Pb free reflow
processes with peak temperatures up to 270oC.
Recommended profiles for reflow and wave soldering are
shown below for reference.
NC products are recommended for lead soldering application
or gluing techniques.
Reflow
a) The visual standards used for evaluation of solder joints
will need to be modified as lead free joints are not as bright
as with tin-lead pastes and the fillet may not be as large.
b) Resin color may darken slightly due to the increase in
temperature required for the new pastes.
c) Lead-free solder pastes do not allow the same self align-
ment as lead containing systems. Standard mounting
pads are acceptable, but machine set up may need to be
modified.
D2
300
250
Preheat
Natural
Cooling
RECOMMENDED
SOLDERING PAD
D1
D3
LAYOUT
200
Dimensions in
D4
150
100
220oC
to
250oC
mm (inches)
REFLOW SOLDERING
D5
50
Case
Size
P/N
D1
D2
D3
D4
D5
300
250
0
1min 1min 10 sec. max
(Minimize soldering time)
0402
0603
0805
1206
NB23
NB21
NB12
NB20
1.70
(.067)
2.30
(.091)
3.00
(.118)
4.00
(.157)
0.60
(.024)
0.80
(.031)
1.00
(.039)
1.00
(.039)
0.50
(.020)
0.70
(.028)
1.00
(.039)
2.00
(.079)
0.60
(.024)
0.80
(0.31)
1.00
(.039)
1.00
(.039)
0.50
(.020)
0.75
(.030)
1.25
(.049)
2.50
(.098)
200
150
WAVE SOLDERING
100
50
0
0
50
100
150
200
250
300
Case
Size
0603
P/N
NB21
D1
3.10
(.122)
D2
1.20
(.047)
D3
0.70
(.028)
D4
1.20
(.047)
D5
0.75
(.030)
? Pre-heating: 150°C ±15°C / 60-90s
? Max. Peak Gradient: 2.5°C/s
? Peak Temperature: 245°C ±5°C
? Time at >230°C: 40s Max.
Time (s)
0805
1206
NB12
NB20
4.00
(.157)
5.00
(.197)
1.50
(.059)
1.50
(.059)
1.00
(.039)
2.00
(.079)
1.50
(.059)
1.50
(.059)
1.25
(.049)
1.60
(.063)
18
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